This report identifies the emerging IoT technologies.

For each of them, it also analyses their:

  • Operating principle including advantages and drawbacks
  • Drivers and barriers
  • Adoption and related impacts for:
    – Verticals (both device manufacturers and end users)
    – Main IoT solution providers along the value chain

Finally, it also provides market estimates and forecasts in terms of annual shipments, for each technology at worldwide levels.

Table des matières

1. Executive Summary

2. Methodology & definitions
2.1. General methodology of IDATE DigiWorld’s reports
2.2. Market assessment and forecasts
2.3. Overall overview of main technologies

3. Hardware technologies: embedded SIM
3.1. Operating principle
3.2. Pros and cons
3.3. Drivers and barriers
3.3.1. Drivers
3.3.2. Barriers
3.4. Vertical adoption
3.4.1. Parts manufacturers
3.4.2. End users
3.5. Main solution providers
3.5.1. SIM card manufacturers
3.5.2. Module manufacturers
3.5.3. Telcos
3.5.4. Platform providers and IT players

4. Connectivity technologies
4.1. 6LoWPAN: pronounced “Six-Low-Pan”
4.1.1. Operating principle
4.1.2. Pros and cons
4.1.3. Drivers and barriers
4.1.4. Vertical adoption
4.1.5. Major solution providers
4.2. LPWA
4.2.1. Operating principle
4.2.2. Pros and cons
4.2.3. Drivers and barriers
4.2.4. Vertical adoption
4.2.5. Main solution providers
4.3. Cellular IoT
4.3.1. Technical description
4.3.2. Pros and cons
4.3.3. Drivers and barriers
4.3.4. Vertical adoption
4.3.5. Main solution providers

5. Middleware technologies
5.1. LwM2M/CoAP
5.1.1. Operating principle
5.1.2. Pros and cons
5.1.3. Drivers and barriers
5.1.4. Vertical adoption
5.1.5. Main solution providers
5.2. MQTT
5.2.1. Operating principle
5.2.2. Pros and cons
5.2.3. Drivers and barriers
5.2.4. Vertical adoption
5.2.5. Main solution providers

6. IT and software technologies: big data and analytics
6.1. Operating principle
6.1.1. Definition
6.1.2. State of the art
6.1.3. Perspective and future developments
6.2. Pros and cons
6.3. Drivers and barriers
6.4. Vertical adoption
6.4.1. Main impacts
6.4.2. Object manufacturers
6.4.3. End Users
6.5. Main solution providers
6.5.1. Module manufacturers
6.5.2. Telcos
6.5.3. IT players

7. Markets and forecasts
7.1. Synthesis
7.2. Market development factors
7.2.1. Drivers
7.2.2. Barriers
7.3. Market forecasts

Table des figures

Table des figures

Table 1: Range and suitability of SIM cards
Table 2: eUICC pros and cons
Table 3: Drivers and barriers of eUICC
Table 4: Adoption of eSIM technology, by verticals
Table 5: Main properties of 802.15.4
Table 6: 6LoWPAN pros and cons
Table 7: Market drivers and barriers to 6LoWPAN
Table 8: 6LoWPAN used in IPSO, Thread and ZigBee IP stacks
Table 9: Application and levels of adoption of 6LoWPAN
Table 10: Characteristics of LPWA
Table 11: LPWA pros and cons
Table 12: LPWA market drivers and barriers
Table 13: Application and adoption rate of LPWA, by vertical
Table 14: Players operating SIGFOX and LoRa
Table 15: Partnerships between platform providers and LPWA providers
Table 16: LTE-M and NB-IoT characteristics
Table 17: Cellular, LTE-M and NB-IoT pros and cons
Table 18: Cellular-based LPWA market drivers and barriers
Table 19: CoAP/LwM2M pros and cons
Table 20: LwM2M/CoAP market drivers and barriers
Table 21: Implementation of LwM2M in IoT platforms
Table 22: MQTT pros and cons
Table 23: MQTT market drivers and barriers
Table 24: Examples of industries and manufacturers having implemented MQTT
Table 25: Implementation of MQTT in IoT platforms
Table 26: Big data pros and cons
Table 27: Drivers and barriers to big data
Table 28: Vertical focus by IoT technology
Table 29: Drivers and barriers to technology development

Figure 1: Key IoT technologies along the technical value chain
Figure 2: Introduction of a new role of subscription manager
Figure 3: Embedded SIM roadmap
Figure 4: eSIM for Samsung Gear S2 Classic 3G
Figure 5: Enjoying Internet connection on tablets without Wifi Hotspot
Figure 6: Major IoT industry players supporting the initiative
Figure 7: Audi connected car service dashboard illustration
Figure 8: Comparison of TCP/IP and 6LoWPAN protocol stacks
Figure 9: 6LoWPAN mesh network in an IPv6 network architecture
Figure 10: Use of 6LoWPAN in Thread
Figure 11: Use of 6LoWPAN in a version of ZigBee
Figure 12: Use of 6LoWPAN in environmental sensor network
Figure 13: Webtech wireless modules
Figure 14: IBM and Libelium development platform using IPv6
Figure 15: Integration of 6LoWPAN-based products
Figure 16: LPWA technologies mapping of RF technologies in terms of range and consumption
Figure 17: SIGFOX operating principle
Figure 18: LoRaWAN network architecture
Figure 19: SIGFOX ecosystem
Figure 20: Requirements of massive IoT networks and time-critical networks in the 5G specifications
Figure 21: Nine large operators officially supporting LTE-M
Figure 22: Comparison of OMA device management (DM) features and OMA Lightweight M2M
Figure 23: LwM2M architecture
Figure 24: CoAP operating principles
Figure 25: OpenAIS consortium
Figure 26: LwM2M/CoAP as part of Zebra Technologies IoT solution for better visibility of assets
Figure 27: Semiconductor company fiscal 2014 revenues and their link with LwM2M (green check)
Figure 28: LwM2M used in Gemalto SensorLogic platform
Figure 29: Integration of LwM2M in cellular architecture
Figure 30: LwM2M and NB-IoT cooperation
Figure 31: MQQT: hub-and-spoke system
Figure 32: Benefits of MQTT over HTTP
Figure 33: Example of MQTT use 49
Figure 34: QoS levels provided by MQTT 50
Figure 35: Use cases for MQTT
Figure 36: IBM Watson using MQTT
Figure 37: Use of big-data analytics in manufacturing
Figure 38: Data analytics on Intel production line
Figure 39: Effects of servicisation on customer relationship
Figure 40: Roadmap of different services offered by industrials
Figure 41: Michelin Solutions architecture
Figure 42: T-Mobile strategy towards the cloud and big data
Figure 43: M2X service description
Figure 44: Evolution of the annual shipments by technologies, worldwide
Figure 45: Evolution of the big-data revenues from Internet of Things markets
Figure 46: Shipments CAGR for each technology, 2017-2025, worldwide

Secteur géographique



  • AT&T
  • Cubic Telecom
  • Gemalto
  • Global M2M Association
  • Samsung


Vertical development

IoT Technologies

  • eUICC – the embedded SIM
  • 6LoWPAN
  • (Unlicensed) LPWAN
  • Cellular IoT (licensed LPWA)
  • LWM2M
  • MQTT
  • Big data

Market analysis

  • Drivers & barriers
  • Adoption of IOT technology will be very fast, and heterogenous

Autres détails

  • Référence : M17320MRA
  • Livraison : on the DigiWorld Interactive platform
  • Langues disponibles : Anglais
  • Tags : 6LoWPAN, analytics, big data, Cellular IoT, connectivity technologies, embedded SIM, eUICC, hardware technologies, Internet of Things, iot, IoT technologies, IT technologies, LPWA, LwM2M/CoAP, middleware technologies, MQTT, software technologies

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